EUV Lithography System Explorer · Supply-Chain & Value Map

Interactive cutaway of an extreme-ultraviolet (13.5 nm) scanner — ASML TWINSCAN NXE architecture (0.33 NA), the only EUV platform in production worldwide. Hover any component for vendors, materials, manufacturing toolchain and estimated share of system value. Click to pin the panel.
λ = 13.5 nm (Sn plasma) >100,000 parts · ~2 km cabling ~180 t · 40 containers · 20 trucks · 3 × 747 freighters NXE:3800E ≈220 wph Sole OEM: ASML (NASDAQ/AMS: ASML)
SUB-FAB LEVEL FAB FLOOR CO₂ drive laser (10.6 µm) EUV light (13.5 nm) — in vacuum, mirrors only Stylized cross-section — not to scale Vacuum enclosure / system envelope — hover edge: final assembly & qualification Base frame · active vibration isolation Metrology frame EUV source vessel · Sn plasma intermediate focus collector mirror tin droplet generator CO₂ drive laser — TRUMPF (sub-fab) Illuminator — ZEISS Projection optics (6-mirror, 4×) — ZEISS Reticle stage (maglev, scans 4×) EUV mask + pellicle Reticle handler · pod load ports expose chuck measure chuck wafer clamp → alignment / level sensors wafer handler ↔ track interface Turbo & dry pump farm H₂ supply & abatement source & laser power stage / sensor racks compute & control comp. lithography
Hover a component, a sidebar row, or a cost-bar segment · click to pin the intel panel · Esc to unpin
Estimated share of system value (% of scanner cost — analyst estimates; ASML does not disclose BOM)

Stage visualization — hover any part to highlight it and see makers & market shares
Process flow (use the stage buttons to switch)
Equipment & tools — hover for makers, tickers and per-wafer $ contribution
Materials & consumables — hover for makers, tickers and per-wafer $ contribution
Company market share for this stage (est. pie charts) — covering only this stage’s equipment & materials
Directional estimates of each company’s share of this stage’s revenue pool (tools weighted by depreciation $, materials by spend $), compiled from public market research. Product-level shares appear in the hover panels above.
Basis: leading-edge logic (3 nm-class) 300 mm wafer, foundry ASP ≈ $18–20k. Material $ = direct consumable spend per wafer; equipment $ = implied tool depreciation per wafer (≈$5–7k total at the leading edge). All figures are directional analyst estimates that vary with node, product and fab loading; not investment advice.
Click component to pin · Esc to close